Mechanical & Layout Information
Figure 13 – SiP package mechanicals; LGA pad, package height
Figure 14 – Recommended PCB Receiving Pattern.
and pad location dimensions – inches.
QPI-10 PCB Layout Recommendations
The filtering performance of the QPI-9 and –10 is
sensitive to capacitive coupling between its input and
output pins. Parasitic plane capacitance must be kept
below 1 pico-Farad between inputs and outputs using
the layout shown above and the recommendations
described below to achieve maximum conducted EMI
performance.
To avoid capacitive coupling between input and output
pins, there should not be any planes or large traces
Figure 15 – Recommended PCB receiving footprint.
Figure 16 – Recommended PCB layout on a 2 layer board
Post Solder Cleaning
Picor lidded QP SIPs are not hermetically sealed and must
not be exposed to liquid, including but not limited to
cleaning solvents, aqueous washing solutions or
pressurized sprays.
When soldering, it is recommended that no-clean flux
that run under both input and output pins, such as a
ground plane or power plane. For example, if there
are two signal planes or large traces where one trace
runs under the input pins, and the other under the
output pins, and both planes over-lap in another area,
they will cause capacitive coupling between input and
output pins. Also, planes that run under both input
and outputs pins, but do not cross, can cause capacitive
coupling if they are capacitively by-passed together.
Figure 16 shows the recommended pcb layout on a 2
layer board. Here, the top layer planes are duplicated
on the bottom layer so that there can be no over-
lapping of input and output planes. This method can
be used for boards of greater layer count.
Ordering Information
solder be used, as this will insure that potentially
corrosive mobile ions will not remain on, around, or
under the module following the soldering process.
For applications requiring water wash compatibility the
“–01” open frame version should be used.
Picor Corporation ? www.picorpower.com
Part
Number
QPI-10LZ
QPI-10LZ-01
Description
QPI-10 LGA Package, RoHS Compliant
QPI-10 LGA, RoHS Compliant
Open Frame Package
QPI-10 Data Sheet Rev. 1.4 Page 7 of 8
相关PDF资料
R0E000200ACB10 ISOLATOR E20 4.05 RX600
R5H30211NB03NQ BOARD ID SECUREMCU
RDK-160 KIT REF DESIGN LINKSWITCH 2
RDK-236 KIT REF DESIGN PFS714EG
RECE-20279-001E-01 RCPT IPEX MHF
RF2594-000 BD540-30
RF2873-000 POLYSWITCH 1.25A RESET FUSE RAD
RGEF1000-1 POLYSWITCH PTC RESET 10A HOLD
相关代理商/技术参数
QPI-10L 制造商:VICOR 制造商全称:Vicor Corporation 功能描述:VI Chip Input EMI Filters
QPI-10LZ 功能描述:IC HOT SWAP EMI FILTER 10LGA RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:Picor®, QUIETPOWER® 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统,AdvancedTCA ? 系统,高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP,10-MSOP(0.118",3.00mm 宽) 供应商设备封装:10-MSOP 包装:管件
QPI-10LZ-01 功能描述:IC HOT SWAP EMI FILTER 10LGA RoHS:是 类别:集成电路 (IC) >> PMIC - 热交换 系列:Picor®, QUIETPOWER® 标准包装:50 系列:- 类型:热交换控制器 应用:-48V 远程电力系统,AdvancedTCA ? 系统,高可用性 内部开关:无 电流限制:可调 电源电压:11.5 V ~ 14.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:10-TFSOP,10-MSOP(0.118",3.00mm 宽) 供应商设备封装:10-MSOP 包装:管件
QPI-11 制造商:VICOR 制造商全称:Vicor Corporation 功能描述:7 A V·I Chip EMI Filter
QPI-11-CB1 功能描述:EVALUATION BOARD FOR QPI-11 RoHS:是 类别:编程器,开发系统 >> 评估演示板和套件 系列:Picor®, QUIETPOWER® 标准包装:1 系列:PSoC® 主要目的:电源管理,热管理 嵌入式:- 已用 IC / 零件:- 主要属性:- 次要属性:- 已供物品:板,CD,电源
QPI-11L 制造商:VICOR 制造商全称:Vicor Corporation 功能描述:VI Chip Input EMI Filters
QPI-11LZ 功能描述:IC INTERFACE FILTER RoHS:是 类别:集成电路 (IC) >> 接口 - 滤波器 - 有源 系列:Picor®, QUIETPOWER® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 滤波器类型:连续时间,带通低通 频率 - 截止或中心:150kHz 滤波器数:4 滤波器阶数:8th 电源电压:4.74 V ~ 11 V,±2.37 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:28-SOIC(0.295",7.50mm 宽) 供应商设备封装:28-SOIC W 包装:带卷 (TR)
QPI-11LZ-01 功能描述:IC INTERFACE FILTER RoHS:是 类别:集成电路 (IC) >> 接口 - 滤波器 - 有源 系列:Picor®, QUIETPOWER® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 滤波器类型:连续时间,带通低通 频率 - 截止或中心:150kHz 滤波器数:4 滤波器阶数:8th 电源电压:4.74 V ~ 11 V,±2.37 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:28-SOIC(0.295",7.50mm 宽) 供应商设备封装:28-SOIC W 包装:带卷 (TR)